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Package Dimensions
Through Hole
9.18~10.18
(0.405)
Surface Mount
9.18~10.18
(0.405)
6.00~7.00
Pin 1
6.00~7.00
Pin 1
3.00~4.00
1.15~1.35
4.50
3.00~4.00
1.15~1.35
(Typ.)
0.35
Typ.
0.26 Typ.
1.00
(Typ.)
2.30~3.30
0.40~0.60
2.29~2.79
15 °
(Max.)
7.62 (Typ.)
0.26 (Typ.)
3.85
Typ.
2.29~2.79
0.40~0.60
0.75~1.25
(Both sides
8.15 (Typ.)
9.86~10.46
0.4" Lead Spacing
9.18~10.18
(0.405)
Pin 1
Recommend Pad Layout for Surface
Mount Leadform
(1.50)
(2.54)
6.00~7.00
(1.30)
(10.50)
(7.90)
3.00~4.00
4.60
(Typ.)
1.15~1.35
1.10
(Typ.)
2.30~3.30
15 °
(Max.)
10.16 (Typ.)
(1.04)
2.29~2.79
0.40~0.60
0.26 (Typ.)
Note:
All dimensions are in millimeters.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package speci?cations do not expand the terms of Fairchild’s worldwide terms and conditions,
speci?cally the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
?2003 Fairchild Semiconductor Corporation
MCT9001 Rev. 1.0.7
5
www.fairchildsemi.com
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